Use este identificador para citar ou linkar para este item:
http://www.repositorio.ufop.br/jspui/handle/123456789/15382
Título: | Interfacial heat transfer and microstructural analyses of a Bi- 5% Sb lead- free alloy solidified against Cu, Ni and low-C steel substrates. |
Autor(es): | Lima, Thiago Soares Cruz, Clarissa Barros da Xavier, Marcella Gautê Cavalcante Reyes, Rodrigo André Valenzuela Bertelli, Felipe Garcia, Amauri Spinelli, José Eduardo Cheung, Noé |
Palavras-chave: | Bi-Sb alloy Solidification Microstructure Interface |
Data do documento: | 2021 |
Referência: | LIMA, T. S. et al. Interfacial heat transfer and microstructural analyses of a Bi- 5% Sb lead- free alloy solidified against Cu, Ni and low-C steel substrates. Journal of Alloys and Compounds, v. 860, artigo 158553, 2021. Disponível em: <https://www.sciencedirect.com/science/article/pii/S0925838820349161>. Acesso em: 29 abr. 2022. |
Resumo: | Bi-Sb system alloys demonstrate high corrosion resistance and good wettability, becoming promising for use as lead-free solder alloys. The simplicity of the phase diagram is also a characteristic of this system, which is isomorphous forming the (Bi,Sb) phase. While extensive research has been performed on heat flow in couples of microelectronics surfaces with eutectic and peritectic alloys, literature regarding the issues of interfacial heat transfer between isomorphous alloys and microelectronics substrates is nonexistent. In this regard, the present research work demonstrates not only the application of a numerical mathematical model for thermal interface conductance but also wetting and interfacial reaction layer results in the formation of phases for the Bi- 5 wt% Sb alloy in different substrate materials. After carrying out the mentioned analyzes in three different conditions, Bi-Sb/copper, Bi-Sb/nickel and Bi-Sb/low-C steel, the wetting angle is shown not to be the predominant factor in controlling the interfacial heat transfer. Instead, the phases forming the interfacial layer from each of the tested substrates have a role in the heat transfer coefficients (h). In the case of the steel substrate, there is no layer formation, which allows greater contact conductance, whereas Bi-Sb/copper and Bi-Sb/nickel couples generate smaller h, being reasonably similar to each other. |
URI: | http://www.repositorio.ufop.br/jspui/handle/123456789/15382 |
Link para o artigo: | https://www.sciencedirect.com/science/article/pii/S0925838820349161 |
DOI: | https://doi.org/10.1016/j.jallcom.2020.158553 |
ISSN: | 0925-8388 |
Aparece nas coleções: | DEENP - Artigos publicados em periódicos |
Arquivos associados a este item:
Arquivo | Descrição | Tamanho | Formato | |
---|---|---|---|---|
ARTIGO_InterfacialHeatTransfer.pdf Restricted Access | 6,8 MB | Adobe PDF | Visualizar/Abrir |
Os itens no repositório estão protegidos por copyright, com todos os direitos reservados, salvo quando é indicado o contrário.